hlmp-cyxx precision optical performance 5mm round warm white led lamps data sheet package dimensions features ? well defned spatial radiation pattern ? high luminous white emission ? viewing angle: 15, 23, 30 and 50 ? standof or non-standof leads description these high intensity white led lamps are based on ingan material technology. a blue led die is coated by phosphor to produce white. the typical resulting color is described by the coordi - nates x= 0.41, y = 0.39 using the cie 1931 chromaticity diagram. these t-1? lamps are untinted, non-difused, and incorporate precise optics which produce well- defned spatial radiation patterns at specifc viewing cone angle. 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min . 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat dimension h: 15: 12.24 0.25mm (0.482 0.01 inches) 23: 12.50 0.25mm (0.492 0.01 inches) 30: 12.00 0.25mm (0.472 0.01 inches) 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min . 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 1.50 0.15 (0.059 0.006) dimension h package dimension a package dimension b caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate during handling and processing. refer to application note an-1142 for additional details.
1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min . 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead 2.35 (0.093) max. cathode flat 1.14 0.20 (0.045 0.008) 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008 ) 31.60 (1.244) min . 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008 ) 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 1.50 0.15 (0.059 0.006) dimension h dimension h: 50: 11.98 0.25mm (0.4715 0.01 inches) note: 1. all dimensions are in millimeters/ inches. 2. epoxy meniscus may extend about 1mm (0.040) down the leads. 3. if heat sinking application is required, the terminal for heat sink is anode. package dimension c hlmp-cy46/47 package drawing package dimension d device selection guide part number typical viewing angle (?) luminous intensity (mcd) at 20ma standof package dimension min. max. hlmp-cy -wz0dd 5 5500 6000 no a hlmp-cy -wz0dd 5 5500 6000 yes b hlmp-cy 6-vy0dd 3 400 000 no a hlmp-cy 7-vy0dd 3 400 000 yes b HLMP-CY36-UX0DD 30 300 9300 no a hlmp-cy37-ux0dd 30 300 9300 yes b hlmp-cy46-tw0dd 50 500 5500 no c hlmp-cy47-tw0dd 50 500 5500 yes d tolerance for each intensity limit is 15%.
3 part numbering system absolute maximum rating t a = 25c parameter white unit dc forward current 30 ma peak forward current 00 [] ma power dissipation 6 mw reverse voltage 5 (i r = 0 a) v led junction temperature 0 c operating temperature range -40 to +85 c storage temperature range -40 to + 00 c notes: 1. derate linearly as shown in figure 2 2. duty factor 10%, frequency 1khz. optical/ electrical performance at 25c parameter symbol min typ max units test condition forward voltage v f .8 3. 3.8 v i f = 0 ma reverse voltage v r 5.0 v i r = 0 a thermal resistance r j-pin 40 ?c/w led junction to anode lead chromaticity coordinate x y 0.4 0.39 i f = 0 ma notes: 1. the reverse voltage of the product is equivalent to the forward voltage of the protective chip at ir = 10 a 2. the chromaticity coordinates are derived from the cie 1931 chromaticity diagram and represent the perceived color of the device. hlmp - c y xx - x x x xx packaging option dd: ammopacks color bin selection 0: open distribution maximum intensity bin 0: no maximum intensity limit minimum intensity bin refer to device selection guide viewing angle color: y: warm white package c: 5mm round lamps 11/12: 15 package 26/27: 23 package 36/37: 30 package 46/47: 50 package
4 figure 1. relative intensity vs. wavelength figure 2. forward current vs ambient temperature figure 3. relative intensity vs forward current figure 4. chromaticity shift vs forward current 0.0 0.2 0.4 0.6 0.8 1.0 380 480 580 680 780 wavelength - nm relative intensity 0 5 10 15 20 25 30 35 0 2 0 4 0 6 0 8 0 100 t a - ambient temperature - c if max. - maximum forward current - ma figure 5. forward current vs forward voltage -0.004 -0.003 -0.002 -0.001 0 0.001 0.002 0.003 -0.006 -0.004 -0.002 0 0.002 0.004 x-coordinate y-coordinate 20ma 30ma 5ma 10ma 0 5 10 15 20 25 30 35 0 1 2 3 4 forward voltage - v forward current - ma 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 5 10 15 20 25 30 35 dc forward current - ma relative luminous intensity (normalized at 20 ma)
5 radiation pattern figure 6. radiation pattern for hlmp-cy11/12 figure 7. radiation pattern for hlmp-cy26/27 figure 8. radiation pattern for hlmp-cy36/37 figure 9. radiation pattern for hlmp-cy46/47 0 0.2 0.4 0.6 0.8 1 0 3 0 6 0 9 0 120 150 180 angular displacement - degrees normalized intensity 0 0.2 0.4 0.6 0.8 1 0 3 0 6 0 9 0 120 150 180 angular displacement - degrees normalized intensity 0 0.2 0.4 0.6 0.8 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity 0 0.2 0.4 0.6 0.8 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity
6 intensity bin limit table at 20ma bin intensity (mcd) at 20 ma min max t 500 300 u 300 400 v 400 5500 w 5500 700 x 700 9300 y 9300 000 z 000 6000 tolerance for each bin limit is 15% color bin limits rank chromaticity coordinates limits x 0.360 0.3988 0.38 0.3545 0.360 y 0.3850 0.46 0.3580 0.3408 0.3850 x 0.3988 0.4390 0.49 0.38 0.3988 y 0.46 0.430 0.375 0.3580 0.46 3 x 0.4390 0.4970 0.4588 0.49 0.4390 y 0.430 0.4466 0.3838 0.375 0.430 tolerance for each bin limit is 0.01 avago warm white binning on cie 1931 chromaticity diagram 0.300 0.350 0.400 0.450 0.500 0.300 0.350 0.400 0.450 0.500 0.550 x y black body bin 1 bin 2 bin 3
7 avago technologies led confguration precautions: lead forming: ? the leads of an led lamp may be performed or cut to length prior to insertion and soldering on pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress that induced into the led package. otherwise, cut the leads to applicable length after soldering process at room temperature. the solder joint formed will absorb the mechanical stress, due to the lead cutting, from traveling to the led chip die attach and wirebond. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. soldering condition: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led closer than 1.59mm might damage the led. ? recommended soldering condition: wave soldering manual solder dipping pre-heat temperature 05 c max. - preheat time 30 sec max - peak temperature 50 c max. 60 c max. dwell time 3 sec max. 5 sec max ? wave soldering parameter must be set and maintain according to the recommended temperature and dwell time. customer is advised to daily check on the soldering profle to ensure that the soldering profle is always conforming to recommended soldering condition. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness led are using high efciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250c. over-stressing the led during soldering process might cause premature failure to the led due to delamination. 1.59mm note: electrical connection between bottom surface of led die and the lead frame material through conductive paste of solder. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? at elevated temperature, the led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of jigs, fxtures or pallet. ? special attention must be given to board fabrication, solder masking, surface platting and lead holes size and component orientation to assure the solderability. ? recommended pc board plated through holes size for led component leads. led component lead size diagonal plated through hole diameter 0.457 x 0.457 mm (0.08 x 0.08 inch) 0.646 mm (0.05 inch) 0.976 to .078 mm (0.038 to 0.04 inch) 0.508 x 0.508 mm (0.00 x 0.00 inch) 0.78 mm (0.08 inch) .049 to .50 mm (0.04 to 0.045 inch) ? under sizing of plated through hole can lead to twisting or improper led placement during auto insertion. over sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. note: refer to application note an1027 for more information on soldering led components. ingan device anode
8 note: the ammo-packs drawing is applicable for packaging option Cdd & -zz and regardless standof or non-standof ammo packs drawing recommended wave soldering profle bottom sid e top side note: allow for boards to be conveyor speed = 1.83 m/min (6 ft/min ) 250 20 0 150 fluxing turbulent wave prehea t time - seconds temperature - c 10 0 50 30 0 10 20 30 40 50 60 70 80 90 10 0 laminar wave hot air knife lead free solder 96.5%sn; 3.0%ag; 0.5% c u sufficiently cooled before exerting mechanical force. of pc board of pc board preheat setting = 15 0 c (10 0 c pcb) solder wave temperature = 24 5 c 5?c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) solder: sn63; flux: rma air knife angle = 4 0 a a 12.701.00 0.500.0394 20.501.00 0.8070.039 18.000.50 0.70870.0197 9.1250.625 0.35930.0246 12.700.30 0.500.0118 0.700.20 0.02760.0079 6.351.30 0.250.0512 ?\c7;4.000.20typ. 0.15750.008 cathode view a-a
note: for ingan device, the ammo pack packaging box contain esd logo packaging box for ammo packs for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 007 avago technologies limited. all rights reserved. av0 -0 en - march 9, 007
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